Semiconductor integration · AI systems

Domain depth, sharpened by AI.

Fifteen years turning fab data into working products. Now using AI to automate the routine and take the analysis deeper.

Now
Principal Engineer, Silicon Photonics Process, Nokia Singapore, from Oct'26.
Before
HP, CompoundTek, STMicroelectronics, GlobalFoundries.
Studying
Master of Computing (Artificial Intelligence), NUS. Part-time, to May'27.
Built
Quinn, an LLM agent platform for fab data.
01 · About

Semiconductor integration engineer who uses AI for automation and deep data analysis

I'm David. In Singapore since 2006: NTU, then 15yrs in its fabs and foundries.

I started in process integration, moved to technology transfer, ran the roadmap and PDK at a photonics foundry, then spent 5yrs in product engineering at HP. From Oct'26 I'm at Nokia on silicon photonics process.

The AI work grew out of the day job. Root-cause work on fab data is repetitive: find the lots, pull the data, join the segments, run the same statistics. Quinn turns that into a conversation. The NUS master's runs alongside it, part-time, to put theory under what I had already built.

Side tracks: 2 VC internships, 2 startups, 6 semesters of teaching.

Outside work
  • Tennis most weeks.
  • Beyblade X with my son.
  • A home lab, run like a small datacentre.
02 · Work

Both sides of the foundry relationship

Customer side at HP and STMicroelectronics. Foundry side at CompoundTek and GlobalFoundries. All in Singapore.

  1. Oct'26 onwards
    NokiaSingapore

    Principal Engineer, Silicon Photonics Process

    Process integration, NPI and the foundry interface for silicon photonics platforms.

  2. Dec'21 to Oct'26
    HPSingapore

    Product Engineering Expert

    • Led new product development for HP's next-generation silicon printhead platform. Foundry interface for NPI and R&D projects.
    • Qualified HP's Southeast Asia wafer and packaging fabs for new products.
    • Cost reduction programs: $1M/yr savings in FY26 from die shrink, mask layer and process step elimination.
    • Initiated and led Quinn, the AI platform for manufacturing data analysis.
    • Built XSection 3D, a KLayout package that shows the process stack of a layout region in 3D.
  3. Feb'20 to Dec'21
    CompoundTekSingapore

    Technology & Program Manager

    A 200mm silicon photonics pure-play foundry.

    • Owned the technology roadmap and the process design kit (PDK).
    • Drove customer programs from first silicon to production release. Half the client base production-ready within 1yr.
    • Designed devices and test structures for process monitoring. Filed 8 provisional patent applications.
    • Partnered with EDA vendors on the PDK and on joint demos: OFC 2020, Cadence CONNECT, an Ansys webinar.
  4. Oct'18 to Feb'20
    STMicroelectronicsSingapore

    Program Management Engineer

    • Supervised advanced BCD technology transfer to the Singapore fab: toolset comparison, recipe matching, short loops, swap lots, qualification.
    • Parametric and yield parity with the sister fab in the first learning cycle. --> Production start pulled in by 1 quarter.
  5. Jan'17 to Oct'18
    GlobalFoundriesSingapore

    Senior Process Integration Engineer

    • Led the 200mm silicon photonics program on an integration scheme distinct from the CMOS baseline. Production readiness for half the customer base within 1yr.
    • Took 0.16um BCD from qualification to risk production at thousands of wafer starts a week, with yield above the mother fab.
  6. Mar'16 to Aug'16
    ArcstoneSingapore and Vietnam

    General Manager, Vietnam

    • Opened the Vietnam market for an MES and industrial IoT company: reseller network, government and university outreach, a smart manufacturing whitepaper.
  7. Aug'12 to Mar'16
    NTUSingapore

    PhD candidate, RFIC design

    • Nanyang President's Graduate Scholarship. Taped out a UWB low-noise amplifier on 65nm CMOS. Teaching assistant for 6 semesters.
    • Left without the degree to take the Arcstone role.
  8. Jun'10 to Jul'12
    GlobalFoundriesSingapore

    Process Integration Engineer

    • Process qualification for new and transferred projects: 0.35um SiGe BiCMOS, 0.35um EEPROM, 0.18um high-voltage. 3 internal awards in 2yrs.
  9. 2009 to 2010
    JointTechSingapore

    Founder

    • Pressure mapping for knee replacement surgery, with Singapore General Hospital. Finalist, Lee Kuan Yew Global Business Plan Competition.
03 · Skills

What I work with

Process

CMOS (BCD), MEMS and silicon photonics processes and devices. Technology transfer end to end: unit-process matching, parametric alignment, reliability qualification, early production ramp. SPC, DOE, process change management, tapeout flow, DRC.

Fab data

Inline, parametric, electrical test, sort and final test. Yield, defect and tool commonality analysis. JMP with JSL, Excel with VBA, Klarity Defect, SQL.

AI and ML

Python with pandas, NumPy, SciPy, scikit-learn, PyTorch. RAG, agentic tool use, multi-agent systems, local LLM serving. Bayesian networks, HMMs, MCMC, variational inference. CNNs, transformers, graph neural networks. Spark. Robot grasp planning in PyBullet.

Design and EDA

KLayout with Ruby and Python scripting: 2D and 3D cross-sections from GDS (XSection 3D), Mentor Calibre DRC, Tanner L-Edit, Lumerical, Cadence, HFSS, ADS.

Programs

Customer programs from first silicon to production release. NPI across foundry, wafer fab and packaging. Cost reduction and process simplification.

Languages

Vietnamese (native), English (fluent).

04 · Education

NUS and NTU

  1. Aug'25 to May'27
    NUSNational University of Singapore

    Master of Computing, Artificial Intelligence

    • Part-time, alongside work. Done: Neural Networks and Deep Learning, Knowledge Discovery and Data Mining, Uncertainty Modelling in AI, Big Data Systems for Data Science. This semester: Graph Machine Learning, Intelligent Robots, AI Principles.
    • Own projects: graph neural networks for HDB prices (details). Robot grasping with vision-estimated friction (details).
    • Team projects: Mini-ImageNet transfer learning, team of 3, 62.7% on 32px images. HDB resale prices, team of 5, R² 0.982 and 6th on the public leaderboard.
  2. 2006 to 2010
    NTUNanyang Technological University

    BEng, Electrical and Electronic Engineering

    • First Class Honours. Dean's List. Specialisation in microelectronics, minor in entrepreneurship. Exchange semester at Monash University.
05 · Projects

Things I built

HP · 2026

Quinn

An LLM agent platform for fab data. 17 agents, 55 tools, piloted with engineers since Jun'26.

Quinn is a chat assistant for semiconductor manufacturing data. Built at HP with the product and process engineers who use it. Pilot since Jun'26.

An engineer asks in plain words. Quinn finds the lots, pulls lot history, electrical test, metrology and inspection data, maps pedigree across wafer, module and assembly segments, runs the analysis and renders the maps. Follow-ups stay in the same chat. Any answer can be kept in a shareable report.

The model picks the analysis. Tested code computes every number.

  • The model reads a catalog of 55 tools and chooses the tool and its arguments. It sees the prompt, its own calls and a capped summary of each result. Never the full data.
  • Every call is checked against the tool's schema before it runs. SQL, statistics and maps are first-party code.
  • Model-written code stays fenced. Pandas runs in a sandboxed child process. SQL runs as one SELECT on the read-only local mirror, never on the warehouse.
  • The model runs on the company's internal LLM gateway. Data, maps and full results stay on the Quinn host.
  • A turn that fails after tools have run returns a partial envelope. --> Completed analysis is never discarded.
# Things engineers ask Quinn
  • Find [product] production lots, Jan to May
  • Extract yield for [lots], split by wafer lot
  • Plot [bin] fail rate by wirebond tool
  • Map pedigree to module and wafer for [lot]
  • Tool commonality: GOOD [parts], BAD [parts]
  • Spatial localisation for [bin] fails, [product]
Engineerasks in plain words
Orchestratorone turn, one result envelope
Tool dispatchevery call schema-checked
Agents17 agents · 55 tools
Fab datanightly mirror + live sources
LLM, the routerpicks the tools · writes the answer
Sees the tool catalog, its own calls and capped result summaries. Never the full data.
extraction · analysis · maps · tool commonality · correlation · split analysis · localisation · cross-segment pedigree · yield reports · uploaded files
lot history · electrical test · inline metrology · inspection images · pedigree across wafer, module and assembly
Return path · Tables, wafer and panel maps, charts and reports render locally and go back to the engineer. Full data frames never cross to the model.
Fig 1 · Quinn, one turn · 2026
Agents
17 agents, 55 tools in the model's catalog. Extraction, analysis, visualisation, tool commonality, correlation, split analysis, lot and spatial localisation, cross-segment pedigree, yield reports, files dropped into the chat.
Statistics
Fisher's exact test with Benjamini-Hochberg FDR for tool commonality. Welch's t and random-effects log-odds for process splits. Lot-clustered Pearson and Kruskal-Wallis for cross-segment correlation. Excess-mass origin verdicts for localisation.
Stack
Python, Streamlit, a DuckDB mirror of the warehouse refreshed nightly, a FastAPI engine sidecar that runs the tool loop, JSON-schema tool contracts. Open-weight Qwen models on Ollama as the local option.
Testing
Routing is graded by replaying a 200-turn prompt catalog through the model. Offline contract tests pin every tool's schema.
Output
Tables, wafer, panel and pick maps, Pareto and fail-rate charts, HTML reports with the CSV behind every table. Daily, weekly and monthly yield monitoring that runs localisation and tool commonality on each signal.
HP · Oct'26

XSection 3D

Runs a fab process script over a layout region and builds the layer stack in 3D.

Draw a box on the layout and pick the process script. Every deposit, etch and implant runs over the whole region, and the result opens in KLayout's 2.5D view. The 4 side faces are the 2D cross sections along the edges of the box.

  • Same process scripts and layer files as KLayout's 2D XSection package.
  • Cut into the model from any face. Make an oxide see-through. Stretch the vertical axis for thin films.
  • Trace a net in the layout and it lights up in 3D: metal, plugs and diffusions.
  • Process steps run on all cores. Every face is checked against the 2D cross section.
Built
At HP, Oct'26. About 8,000 lines of Ruby on KLayout.
Pictures
A generic SOI test chip drawn for this page: 220nm silicon on 2um oxide, strip and rib waveguides, n and p implants, tungsten contacts, a TiN heater, aluminium. No foundry's process or design.
3D model of a silicon photonics test chip: a grating coupler and taper on the left, a ring resonator under an orange TiN heater in the middle, a PN phase shifter with rows of contacts on the right, under see-through oxide.
Fig 2 · Generic SOI chip · height ×3
Close-up of the ring resonator next to the bus waveguide, with the orange TiN heater arc above it and two aluminium contacts on its ends.
Fig 3 · Heated ring resonator
The PN phase shifter cut open: violet n-type and magenta p-type silicon either side of the rib waveguide, rows of tungsten contacts and two aluminium lines above.
Fig 4 · PN phase shifter, cut open
NUS · Oct'26

HDB prices on a graph

5 graph neural networks from scratch, to price HDB blocks that have never been resold.

Can a graph over Singapore's HDB blocks price a block that has never been resold, and which graph works best? Each of the 10.8k blocks is a node, linked to its nearest neighbours and described by 13 layers of nearby amenities: MRT, schools, hawker centres, parks, malls and more.

  • GCN, GraphSAGE, GAT, a learned-edge convolution and a Graph Transformer, written from scratch in PyTorch. Against an MLP, LightGBM, kNN and linear baselines.
  • 280 runs: 18 models, a temporal and a spatial split, 4 graph densities, 5 seeds, an amenity ablation. 1h50min on a DGX Spark.
  • LightGBM with coordinates wins everywhere: 0.052 RMSE on log price per m², about 4% error. No neural model beats it on any 5-seed mean.
  • Amenities and message passing are substitutes. With no amenity features the GCN beats the same network without a graph on held-out blocks in all 5 seeds. With 13 layers the gain is gone.
  • New estates are 8yrs old against 34 for the blocks the models trained on, and sell about 33% higher per m². Every model under-prices them, the more so the more it leans on its neighbours.
Map of Singapore's HDB blocks as dots, shaded by resale price per square metre: the dearest in the central estates, the cheapest in the west and north. The 138 new blocks are amber, at the edges of older towns.
Fig 5 · HDB price per m², by block
Course
NUS CS5284 Graph Machine Learning. A group project, done solo, Oct'26.
Data
241k HDB resales, Jan'17 to Sep'26, from data.gov.sg. Amenities from data.gov.sg (8 layers) and OpenStreetMap (5).
Map
Faint to strong blue: S$2.4k to S$5.6k per m², in 2009 prices. Amber: the 138 blocks with no resale before 2025.
Edges
The learned-edge convolution found estate boundaries by itself. At the same distance, a neighbour on the same street weighs 3.3 times one on another street.
Finding
The new estates a graph should help most are the least like their neighbours.
NUS · Sep'26

Friction-aware grasping

Estimate friction from one photo, then plan the grasp and the grip force.

Grasp planners score a grasp through the friction at the fingertips, yet almost always assume one friction value for every object. This project asks whether estimating it from a single photo, before contact, picks better grasps.

  • Photo, then a material classifier, then a spread of friction values. Plan at the pessimistic end of that spread, rank the grasps and set the grip force.
  • Tested in PyBullet on 10 YCB objects, paired: one constant friction, an oracle that knows the true value, and a 2×2 that separates which grasp is chosen from how hard it is squeezed.
  • Knowing the friction raises lift success by 5 points, 9 on slippery objects and 26 on metal. All of the gain comes from grip force. Choosing a different grasp with the true friction does not help.
Course
NUS CS5478 Intelligent Robots. Individual project, Sep'26.
Models
MobileNetV3-Small fine-tuned on MINC-2500 (1.53M parameters, 70.1% top-1), DMS46 (46.7M), zero-shot CLIP ViT-B/32 (151M).
Grasps
Soft-finger friction cones, Ferrari-Canny ε metric, antipodal candidates.
Finding
A friction estimate before contact earns its keep in setting the grip force, not in ranking grasps.
Home · ongoing

Home lab

Proxmox, a GB10 box serving a 120B model, an 80TB NAS, my own assistant.
Servers
Proxmox VE with LXC containers and Ubuntu VMs behind a reverse proxy. GPU passthrough for transcoding. Unprivileged containers mapped to NFS storage.
AI box
NVIDIA GB10 Grace Blackwell, 128GB unified memory. Serves Nemotron 3.5 Super (120B, 12B active) with vLLM to every machine in the house. About 55 tok/s, up to 1M tokens of context.
Laptop
MacBook Pro M5 Pro running Qwen3.6-35B locally, about 70 tok/s. Claude Code works on both models.
Storage
80TB NAS over NFS and SMB.
Network
UniFi, split into VLANs, 10GbE between the servers. Tailscale for remote access. Key-based SSH only.
Emma
My own assistant, on a Proxmox VM. Answers on Discord and Telegram.
06 · Contact

Email works best

Email
david@davidngo.com
LinkedIn
linkedin.com/in/ngothanhtrung
GitHub
github.com/davidngo256
Location
Singapore